Qualcomm's latest silicon is all in on agentic AI. Here is everything revealed at Snapdragon Summit 2026.

Yesterday Qualcomm announced the Snapdragon 8 Elite Extreme Gen 6 as quite an interesting mobile SoC

Qualcomm acquires PickNik to expand physical AI and robotics, integrating MoveIt with Dragonwing and Arduino platforms.

Qualcomm plans to integrate the Dragonwing and Arduino platforms with the MoveIt open-source manipulation framework.

Just how powerful a chip can you stick in a phone and not expect it to take up a ton of space?

Someday, AI agents will buy you anything you want — or what they think you want. Here's how the chipmaker for top Android phones thinks that may work.

QUALCOMM (NasdaqGS:QCOM), Lumentum and Corning plan to showcase a high-density die-to-die optical interconnect for AI scale-up architectures at ECOC 2026. The joint demo will pair QUALCOMM's die-to-die interface IP subsystem with Lumentum VCSEL-based optical links and Corning fiber connectivity. The ECOC 2026 presentation targets higher bandwidth and lower latency connections for AI data center systems using optical interconnects. This new die-to-die optical interconnect effort only captures...

The agentic AI experience needs to be personal, proactive, responsive, trusted and - above all - effortless, Cristiano Amon said.

Qualcomm's Snapdragon 8 Elite Extreme Gen 6 chip will be in the top phones of 2026 and 2027. Here's what it can do.

Qualcomm unveiled two flagship mobile platforms, Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Extreme Gen 6, at Snapdragon Summit 2026 in Maui, Hawaii this week, marking the company